INTERGEO 2025 | XIMEA.com

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Discover the future of geospatial imaging

Join us at INTERGEO to learn how our cameras are powering the next generation of solutions for mapping, surveying, UAV imaging, and 3D spatial data capture. Built to deliver precision, speed, and reliability in even the most challenging environments, our technology is used in everything from airborne systems to mobile platforms.

Whether you're creating high-resolution digital twins, integrating advanced vision systems into drones, or developing real-time GIS workflows, our camera systems are designed to support complex, multi-sensor setups with ease. With global shutter sensors, hardware-level synchronization under one millisecond, and high-throughput data streaming via PCIe or USB3, XIMEA systems are optimized for performance, flexibility, and scalability.

At INTERGEO, we’ll present compact, modular solutions, including cameras with detached sensor heads, ultra-high-res imaging modules, and fully integrated systems for photogrammetry, and real-time 3D processing.

Step into a new era of geospatial imaging powered by XIMEA.

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MX2457 - PCIe speed and Sony IMX811 brilliance

The XIMEA MX2457 from our xiX-XL carmera series sets a new standard in ultra-high-resolution imaging, featuring 245.7 megapixels, a high-speed PCIe Gen3 interface, and advanced BSI sensor technology for outstanding image quality. Engineered for aerial mapping, photogrammetry, and optical inspection, the MX2457 combines massive resolution with high-speed data throughput and precise detail capture, even in demanding, real-time environments. Its removable sensor head and optional liquid cooling provide unmatched flexibility, ideal for custom system integration and thermally challenging setups.
Exclusively, the xiX-XL camera series features the most advanced large-format sensors on the market, including the Sony IMX455, IMX461, IMX411, and IMX811. This makes it the preferred solution for geospatial professionals, scientific researchers, and those in the field of precision metrology.

MX2457

xiMU camera series - now even with global shutter BSI sensors

Engineered for minimal volume and weight, our xiMU cameras are the world's smallest industrial-grade cameras (down to 15 x 15 mm). Built using advanced, high-density manufacturing techniques, they feature rolling and global shutter CMOS sensors with resolutions of up to 20 Mpix and frame rates of up to 60 FPS. These features make them ideal for capture of fast motion in drone mapping, mobile surveying, and dynamic 3D data acquisition. A USB3 interface ensures low-latency, high-bandwidth data transfer for real-time vision and geospatial pipelines. Full GenICam support, hardware triggering, and a robust SDK enable precise synchronization in complex, multi-camera systems.

xiMU series

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xiX camera series - Precision, flexibility, and scalability

Designed for high performance and scalability, the xiX camera series supports multiple synchronized modules and resolutions of up to 65 megapixels.

Thanks to low-latency image delivery and a compact form factor, xiX cameras integrate smoothly in tight spaces. The PCIe interface ensures ultra-fast, reliable data transfer without compromise.

With modular configurations and support for a variety of sensor types, including Sony Pregius™ S and CMOSIS, xiX cameras offer adaptability and flexibility required for complex imaging systems.

xiX series

XIMEA offers custom carrier boards for NVIDIA Jetson™ modules (Orin NX, Xavier, Nano) that support up to three PCIe-based xiX cameras, with high-speed data transfer via FireFly cables, M.2 NVMe storage, and 10 GbE. This setup enables real-time embedded vision systems with low latency, capable of processing and streaming multiple synchronized camera feeds using the Jetson’s onboard GPU for tasks like color correction, demosaicing, encoding, and AI inference. Ideal for compact, high-performance applications in robotics, XR, and edge AI.

Multi-camera and embedded systems

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Discover the next generation of compact, scalable imaging with XIMEA cameras for embedded and multi-camera systems. Designed for real-time 3D capture, volumetric video, and spatial computing, these ultra-small cameras feature high-quality CMOS sensors and USB3 or PCIe interfaces — all optimized for synchronization, minimal latency, and easy integration. Whether you're building a dense camera array or an edge AI vision system, XIMEA gives you the flexibility and performance to scale your creative and computational vision.

Embedded vision cameras

Detachable sensor head cameras

Discover new levels of flexibility with XIMEA’s xiX-Xtreme modular camera design featuring detachable sensor heads and Sony Pregius S sensors. By separating the sensor from the main camera body, these systems enable remote placement in confined or harsh environments, while reducing thermal impact to optimize image quality.
Perfect for applications with space constraints or demanding conditions, they simplify integration and expand system design freedom.

xiX-Xtreme series

Bring your vision to life - visit XIMEA at booth #0A095!

Whether you're building custom systems or scaling imaging workflows, we're here to support your next breakthrough.
On-site or remote, our team is ready to connect.

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Click the contact button below to schedule a one-on-one meeting.

Get in touch now and turn your ideas into reality.

New sensor models are now available across xiX-XL and xiX-Xtreme series cameras, providing you with immediate access to the latest in high-performance imaging. The detachable sensor head at the core redefines what's possible in system architecture, thermal control, and overall performance. Both camera series feature a PCIe Gen3 interface, ensuring high-speed data transfer and low-latency. The choice between xiX-XL and xiX-Xtreme depends on a blend of maximum resolution, frame rate and form factor needed for your specific application.