Ultra-compact PCIe cameras with detachable sensor heads

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Senzors

A feat of engineering

The XIMEA xiX-Xtreme and xiX-XL camera series are fully fledged power horses. As a first-in-class, both camera families class to implement a modular and detachable sensor head system. By decoupling the sensor from heat-intensive processing electronics, thermal interference is minimized, enabling the sensor to consistently operate at peak performance. This results in enhanced image stability, reduced noise, and improved SNR, particularly in long exposures or high-throughput imaging. The sensor module's outstanding performance to size ratio allows integration into tight or mobile environments, while the main body can be thermally isolated or actively cooled. A clear advantage for machine vision and embedded systems.

Large format award nominee

The state-of-the-art XIMEA MX2457 features 245.7 Mpix, a PCIe Gen3 interface, and advanced BSI technology. Ideal for demanding applications like aerial mapping, optical inspection, and photogrammetry.

The MX2457 delivers exceptional image quality with high-speed data throughput. With a removable sensor head and optional liquid cooling, the MX2457 offers unmatched flexibility and integration potential, allowing you to push the boundaries of what's possible in high-resolution imaging.

Exclusively the xiX-XL camera platform supports top-tier sensors including the Sony IMX455, IMX461, IMX411, and IMX811, making it the go-to solution for scientific research, metrology, medical diagnostics, and any application requiring ultra-high-resolution imaging.

xiX-XL series

Fourth Gen. Sony CMOS Pregius S sensors

Resolutions from 5.1 to 12.4 Mpix with USB3 or PCIe interfaces, these models feature BSI tech and 2.74 µm pixels for exceptional image quality, all in a compact 26 × 26 × 33 mm housing.

The XIMEA xiX-Xtreme is engineered for high-speed imaging in the most space-constrained environments. Powered by Sony's latest Pregius S sensors, including the IMX530, IMX531, and IMX532, it delivers exceptional frame rates for applications with spatial restrictions like quality inspection, robotics, and embedded vision.

High-speed performance, HDR capability, and low power consumption make them the ideal choice for scientific imaging and machine vision.

Resolutions from 5.1 to 12.4 Mpix with USB3 or PCIe interfaces, these models feature BSI tech and 2.74 µm pixels for exceptional image quality, all in a compact 26 × 26 × 33 mm housing.

The XIMEA xiX-Xtreme is engineered for high-speed imaging in the most space-constrained environments. Powered by Sony's latest Pregius S sensors, including the IMX530, IMX531, and IMX532, it delivers exceptional frame rates for applications with spatial restrictions like quality inspection, robotics, and embedded vision.

High-speed performance, HDR capability, and low power consumption make them the ideal choice for scientific imaging and machine vision.

xiX-Xtreme series

Engineered for minimal SWaP

Modular design with a detached sensor head
Compact mechanical footprint
Power-efficient data handling via PCIe
Support for embedded system integration

This architecture is ideal for applications such as embedded vision, robotics, drones, AR/VR systems, and mobile scientific instruments that require high-quality imaging without the bulk.

XIMEA xiX-XL MX2457 engineering pcb assembly

New sensor models are now available across xiX-XL and xiX-Xtreme series cameras, providing you with immediate access to the latest in high-performance imaging. The detachable sensor head at the core redefines what's possible in system architecture, thermal control, and overall performance. Both camera series feature a PCIe Gen3 interface, ensuring high-speed data transfer and low-latency. The choice between xiX-XL and xiX-Xtreme depends on a blend of maximum resolution, frame rate and form factor needed for your specific application.