We are thrilled to announce that XIMEA will be showcasing our latest imaging solutions at INTERGEO 2025 in Frankfurt!
We will highlight our expanding portfolio tailored to aerial mapping, surveying, and other applications requiring flexible payload integration.
At the heart of our offering are compact, lightweight camera systems designed to deliver maximum image quality with minimal payload impact. Our cameras support resolutions up to 245.7 Mpix and cover a wide spectrum, from visible light to multispectral and hyperspectral imaging. This makes them ideally suited for unmanned aerial vehicle (UAV)-based mapping, GIS data acquisition, environmental monitoring, and precision agriculture.
Our modular approach enables customizable payload configurations that can be adapted to diverse mission requirements. By combining high-resoultion sensors with low power consumption and advanced interfaces, we empower system integrators and operators to capture detailed geospacial data without compromising flight time or efficiency.
Our camera technology allows customers to design payloads that fit their exact application - whether that’s ultra-high-resolution photogrammetry, multispectral analysis, or lightweight inspection systems.
Join us at booth 0A095 to explore our latest innovations and learn how XIMEA’s imaging solutions continue to redefine the possibilities of aerial data capture.
