Heatsink with thermagon
- Heat sink can be mounted on top of camera for heat dissipation
- Measures: 25 x 25 x 18 mm
- Weight: 12.5 grams
- Material - BGA Aluminum Alloy, black anodized
- Attachment Method - with Adhesive Thermal pad (included in delivery)
- Power Dissipation @ Temperature Rise - 5.5W @ 75°C
- Thermal Resistance @ Forced Air Flow - 4.50°C/W @ 200 LFM
- Thermal Resistance @ Natural - 13.70°C/W
- For use with xiC and xiX camera series
- Part Number: MECH-25MM-HEATSINK-KIT
Camera line brochure
Accessories options
Mechanical drawing
Heat dissipation curve