Heatsink with thermagon

Heatsink with thermagon
  • Heat sink can be mounted on top of camera for heat dissipation
  • Measures: 25 x 25 x 18 mm
  • Weight: 12.5 grams
  • Material - BGA Aluminum Alloy, black anodized
  • Attachment Method - with Adhesive Thermal pad
  • Power Dissipation @ Temperature Rise - 5.5W @ 75°C
  • Thermal Resistance @ Forced Air Flow - 4.50°C/W @ 200 LFM
  • Thermal Resistance @ Natural - 13.70°C/W
  • For use with xiC and xiX camera series
  • Part Number: MECH-25MM-HEATSINK-KIT

Camera line brochure

 

Accessories options

 

Mechanical drawing

 

Heat dissipation curve

 

CONTACT SALES

Last Updated: 03 December 2022, 05:38

Follow XIMEA on


 

YouTube XIMEA              facebook XIMEA

 

 

Instagram XIMEA              twitter XIMEA

 

 

                   linkedin XIMEA

 

Build your Embedded application

Check our concept for Multi-camera aggregation 

 

Embedded Vision system camera USB3 fast small multiple

 

Contact us about your Embedded Vision needs!