Heatsink with thermagon

Heatsink with thermagon
  • Heat sink can be mounted on top of camera for heat dissipation
  • Measures: 25 x 25 x 18 mm
  • Weight: 12.5 grams
  • Material - BGA Aluminum Alloy, black anodized
  • Attachment Method - with Adhesive Thermal pad
  • Power Dissipation @ Temperature Rise - 5.5W @ 75°C
  • Thermal Resistance @ Forced Air Flow - 4.50°C/W @ 200 LFM
  • Thermal Resistance @ Natural - 13.70°C/W
  • For use with xiC and xiX camera series
  • Part Number: MECH-25MM-HEATSINK-KIT

Camera line brochure


Accessories options


Mechanical drawing


Heat dissipation curve



Last Updated: 01 March 2024, 14:15

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